Antenna package structure and antenna packaging method

ABSTRACT

The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes an antenna circuit chip, a first packaging layer, a first rewiring layer, an antenna structure, a second metal connecting column, a third packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using the rewiring layer and the metal connecting column.

CROSS REFERENCES TO RELATED APPLICATIONS

This application is the divisional application of U.S. patentapplication Ser. No. 16/354,464, filed Mar. 15, 2019, entitled “ANTENNAPACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD”. This application claimsthe benefits of priority to U.S. patent application Ser. No. 16/354,464,Chinese Patent Application No. CN2018102176834, entitled “ANTENNAPACKAGE STRUCTURE AND ANTENNA PACKAGING METHOD”, filed with CNIPA onMar. 16, 2018, and Chinese Patent Application No. CN2018203595243,entitled “ANTENNA PACKAGE STRUCTURE”, filed with CNIPA on Mar. 16, 2018,the contents of which are incorporated herein by reference in itsentirety.

TECHNICAL FIELD

The present disclosure relates to the field of semiconductor packaging,and in particular, to an antenna package structure and an antennapackaging method.

BACKGROUND

Various high-tech electronic products have been developed to bringconvenience to users, including devices such as laptops, mobile phones,and portable Android devices (PAD), etc.

Increased demands for these popular high-tech electronic products haveenabled more functions and applications configured into these high-techproducts. In addition, to meet the need for mobilization, the functionof wireless communication is provided. Thus, users can access thehigh-tech electronic devices with the function of wireless communicationanywhere or any time. This greatly increases the flexibility andconvenience in use of these products. Therefore, users no longer have tobe confined to a certain area, and can enjoy the convenience brought bythese electronic products.

In general, existing antenna structures in IC devices usually have manytypes, for examples, they are dipole antenna, monopole antenna, patchantenna, planar inverted-F antenna, meander line antenna, inverted-Lantenna, loop antenna, spiral antenna and spring antenna. A knownpractice is to manufacture an antenna directly on the surface of acircuit board. By this practice, an antenna occupies an extra space ofthe circuit board, thereby resulting in a low integration level to thechip. For various electronic devices, a large circuit board means alarge size. However, the main purpose of designing and developing theseelectronic devices is to allow users to carry them easily. Therefore,how to reduce the area of the circuit board occupied by an antenna, andimprove the integration performance of an antenna packaging structure isthe key to solve the problems of these electronic devices.

In addition, an existing antenna package is typically of a single-layerstructure with low antenna efficiency, which cannot meet the increasingdemand for antenna performance.

Based on the above, it is necessary to provide a packaging structure andpackaging method for an antenna with a high degree of integration andhigh efficiency.

SUMMARY

The present disclosure provides an antenna package structure, including:an antenna circuit chip; a first packaging layer, disposed on theantenna chip, wherein the first packaging layer comprises a firstsurface and a second surface opposite to the first surface, wherein twoports on a front surface of the antenna chip are exposed from the firstsurface; a first rewiring layer, formed on the first surface of thefirst packaging layer, wherein the first rewiring layer comprises afirst surface connected to the two ports of the antenna chip, wherein asecond surface is opposite to the first surface; an antenna structure,comprising a second packaging layer, a first antenna metal layer, asecond rewiring layer, and a first metal bump, where the first antennametal layer is disposed on a first surface of the second packaginglayer, the second rewiring layer is disposed on a second surface of thesecond packaging layer, the first antenna metal layer is electricallyconnected to the second rewiring layer by a first metal connectingcolumn passing through the second packaging layer, the first metal bumpis formed on the second rewiring layer, and bonded to the first rewiringlayer; a second metal connecting column, formed on the second surface ofthe first rewiring layer, where the second metal connecting column isnot lower than a top surface of the antenna structure; a third packaginglayer, wrapping the antenna structure, where a top surface of the secondmetal connecting column is exposed from the third packaging layer; asecond antenna metal layer, formed on a surface of the third packaginglayer, wherein the second antenna metal layer is connected to the secondmetal connecting column; and a second metal bump, formed in a via holein the first packaging layer, and electrically connected to the firstsurface of the first rewiring layer.

Preferably, the material of the first packaging layer comprises one ofpolyimide (PI), silica gel, and epoxy resin, the material of the secondpackaging layer comprises one of PI, silica gel, and epoxy resin, andthe material of the third packaging layer comprises one of PI, silicagel, and epoxy resin.

Preferably, the first rewiring layer comprises a first patterneddielectric layer and a first patterned metal wiring layer.

Preferably, the second rewiring layer comprises a stack of a secondpatterned dielectric layer, a second patterned metal wiring layer, and athird patterned dielectric layer.

Preferably, the material of the first patterned dielectric layercomprises one or a combination of epoxy resin, silica gel, PI, PBO, BCB,silica, phosphosilicate glass, and fluorine-containing glass, and thematerial of the metal wiring layer comprises one or a combination ofcopper, aluminum, nickel, gold, silver, and titanium.

Preferably, the material of the first metal connecting column and thesecond metal connecting column comprises one of Au, Ag, Cu, and Al.

Preferably, the first metal bump and the second metal bump each compriseone of a tin solder, a silver solder, and a gold-tin alloy solder.

Preferably, the footprint area of the first rewiring layer is greaterthan the footprint area of the antenna structure, and the second metalconnecting column is distributed on the second surface of the firstrewiring layer at the periphery of the antenna structure.

Preferably, the second antenna metal layer has a window in an areavertically aligned with the first antenna metal layer, to prevent thesecond antenna metal layer from blocking the first antenna metal layer.

The present disclosure further provides an antenna packaging method. Thepackaging method comprises: 1) providing a first support substrate, andforming a separation layer on the first support substrate; 2) providingan antenna circuit chip, and adhering the antenna circuit chip to theseparation layer, where a front surface of the antenna circuit chip isfacing the separation layer; 3) disposing a first packaging layer on theantenna circuit chip; 4) stripping off the separation layer and removingthe first support substrate, to expose the front surface of the antennacircuit chip; 5) forming a first rewiring layer on the first packaginglayer, wherein two ports of the antenna circuit chip are exposed,wherein the first rewiring layer comprises a first surface connected tothe first packaging layer and a second surface opposite to the firstsurface; 6) providing an antenna structure, where the antenna structurecomprises a second packaging layer, a first antenna metal layer, asecond rewiring layer, and a first metal bump, where the first antennametal layer is disposed on a first surface of the second packaginglayer, the second rewiring layer is disposed on a second surface of thesecond packaging layer, the first antenna metal layer is electricallyconnected to the second rewiring layer by a first metal connectingcolumn passing through the second packaging layer, and the first metalbump is formed on the second rewiring layer; 7) bonding the secondsurface of the first rewiring layer to the first metal bump; 8) forminga second metal connecting column on the second surface of the firstrewiring layer, where the second metal connecting column is not lowerthan a top surface of the antenna structure; 9) disposing a thirdpackaging layer over the antenna structure, performing planarizationtreatment on a surface of the third packaging layer, to expose a topsurface of the second metal connecting column from the third packaginglayer; 10) forming a second antenna metal layer on the surface of thethird packaging layer, where the second antenna metal layer is connectedto the second metal connecting column; and 11) forming a via hole, inthe first packaging layer, for exposing the first rewiring layer, andforming a second metal bump in the via, to achieve electrical lead-outof the first rewiring layer.

Preferably, the first support substrate comprises one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate, and a ceramic substrate, the separation layer comprises oneof an adhesive tape and a polymer layer, and the polymer layer is firstcoated on a surface of the first support substrate by using aspin-coating process, and then is cured by using an ultra-violet curingprocess or a thermal curing process.

Preferably, in the step 3), a method for depositing the antenna chipwith the first packaging layer comprises one of the methods likecompression molding, transfer molding, liquid seal molding, vacuumlamination, and spin-coating, and the material of the first packaginglayer comprises one of PI, silica gel, and epoxy resin; and in the step9), a method for packaging the antenna structure by using the thirdpackaging layer comprises one of compression molding, transfer molding,liquid seal molding, vacuum lamination, and spin-coating, and thematerial of the third packaging layer comprises one of PI, silica gel,and epoxy resin.

Preferably, in the step 4), a method for stripping off the separationlayer and removing the first support substrate comprises one ofmechanical stripping and chemical stripping.

Preferably, the step 5) of manufacturing the first rewiring layercomprises steps: 5-1) forming a first dielectric layer on the surface ofthe first packaging layer by using a chemical vapor deposition processor a physical vapor deposition process, and patterning the firstdielectric layer; and 5-2) forming a first metal layer on the firstdielectric layer by using a chemical vapor deposition process, anevaporation process, a sputtering process, an electroplating process, oran electroless plating process, and etching the metal layer to patternthe metal wiring layer.

Further, the material of the dielectric layer comprises one or acombination of epoxy resin, silica gel, PI, PBO, BCB, silica,phosphosilicate glass, and fluorine-containing glass, and the materialof the metal wiring layer comprises one or a combination of copper,aluminum, nickel, gold, silver, and titanium.

Preferably, the step 6) of providing the antenna structure comprises:6-1) providing a second support substrate, and forming a stripping layeron the second support substrate; 6-2) forming a first antenna metallayer on the stripping layer, and forming a first metal connectingcolumn on the first antenna metal layer; 6-3) depositing a secondpackaging layer on the first antenna metal layer and the first metalconnecting column, and performing planarization treatment on the secondpackaging layer, to expose the first metal connecting column; 6-4)forming a second rewiring layer on the second packaging layer, andforming a first metal bump on the second rewiring layer; 6-5) separatingthe second support substrate from the second packaging layer, to exposethe first antenna metal layer; and 6-6) performing cutting to formindividual antenna structures.

Preferably, the second metal connecting column is manufactured by usinga wire bonding process, where the wire bonding process comprises one ofa thermal compression wire bonding process, an ultrasonic wire bondingprocess, and a thermal compression ultrasonic wire bonding process, andthe material of the second metal connecting column comprises one of Au,Ag, Cu, and Al.

Preferably, a material of the first metal bump and the second metal bumpeach comprise one of a tin solder, a silver solder, and a gold-tin alloysolder.

Preferably, the width of the first rewiring layer is greater than thewidth of the antenna structure, and the second metal connecting columnis distributed on the first rewiring layer at the periphery of theantenna structure.

Preferably, the second antenna metal layer has a window in an areavertically aligned with the first antenna metal layer, to prevent thesecond antenna metal layer from blocking the first antenna metal layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 19 show the sequential structural diagrams following each ofthe steps of fabricating an antenna package according to one embodimentin the present disclosure.

FIG. 20 shows the structural diagram of the completed antenna packageaccording to the embodiment of the present disclosure.

Descriptions of reference numerals 101 First support substrate 102Separation layer 103 Antenna circuit chip 1031 Connecting ports 104First packaging layer 105 First rewiring layer 1051 First dielectriclayer 1052 First metal wiring layer 106 Second metal connecting column107 Third packaging layer 108 Second antenna metal layer 109 Secondmetal bump 110 Window 201 Second support substrate 202 Stripping layer203 First antenna metal layer 204 First metal connecting column 205Second packaging layer 206 Second rewiring layer 2061 Second dielectriclayer 2062 Second metal wiring layer 207 First metal bump

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Implementations of the present disclosure are described below by usingparticular and specific examples, and a person skilled in the art caneasily understand other advantages and efficacy of the presentdisclosure from content disclosed in the specification. The presentdisclosure can further be implemented or applied by using otherdifferent specific implementations, details in the specification canalso be based on different opinions and applications, and variousmodifications and changes can be made without departing the spirit ofthe present disclosure.

It should be noted that, figures provided in embodiments describe thebasic idea of the present disclosure only in a schematic manner; onlycomponents related to the present disclosure are shown in the figuresinstead of drawing components based on the quantity, the shape, and thesize of the components required during actual implementation; and theshape, the quantity, and the ratio of each component during actualimplementation can be changed randomly, and the layout shape of thecomponents may be more complex.

As shown in FIGS. 1 to 20, an antenna packaging method is provided. Thepackaging method comprises the following steps.

As shown in FIG. 1, step 1): providing a first support substrate 101,and forming a separation layer 102 on the first support substrate 101.

In an example, the first support substrate 101 may be one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate, and a ceramic substrate. In this embodiment, the firstsupport substrate 101 is a glass substrate. Glass substrate is low incost, and it is easy to form the separation layer 102 on a surface ofthe glass substrate, and a difficulty of a subsequent stripping processcan be lowered.

In an example, the separation layer 102 may be an adhesive tape or apolymer layer. The polymer layer is first coated on a surface of thefirst support substrate 101 by using a spin-coating process, and then iscured by using a ultra-violet curing process or a thermocuring process.

In this embodiment, the separation layer 102 is thermocuring adhesive.After the thermocuring adhesive is formed on the first support substrate101 by the spin-coating, the thermocuring adhesive is cured by using thethermocuring process. The thermocuring adhesive has stable performance,and a smooth surface, which facilitates manufacturing of a subsequentrewiring layer. In addition, in a subsequent stripping process, astripping difficulty is low.

As shown in FIG. 2, step 2): providing an antenna circuit chip 103, andadhering the antenna circuit chip 103 to the separation layer 102,wherein a front surface of the antenna circuit chip 103 is toward theseparation layer 102. The antenna circuit chip 103 is provided with twoconnecting ports 1031.

As shown in FIG. 3, step 3): depositing a first packaging layer 104 overthe antenna circuit chip 103. The thickness of the first packaging layer104 is greater than the thickness of the antenna circuit chip 103, toachieve a better protection effect.

In an example, a method for packaging the antenna chip by using thefirst packaging layer 104 may be one of compression molding, transfermolding, liquid seal molding, vacuum lamination, and spin-coating, andthe material of the first packaging layer 104 may be one of polyimide(PI), silica gel, and epoxy resin.

As shown in FIG. 4, step 4): stripping off the separation layer 102 andremoving the first support substrate 101, to expose the front surface ofthe antenna circuit chip 103.

In an example, the first packaging layer 104 and the first supportsubstrate 101 may be separated and stripped off by using a method suchas mechanical stripping, laser stripping, or chemical stripping (such aswet etching) according to an property of the separation layer 102.

As shown in FIG. 5a and FIG. 5b , step 5): forming a first rewiringlayer 105 on the front surface of the antenna circuit chip 103 and thesurface of the first packaging layer 104, wherein the first rewiringlayer 105 comprises a first surface connected to the first packaginglayer 104 and a second surface opposite to the first surface.

The step 5) of manufacturing the first rewiring layer 105 comprises thefollowing steps.

Step 5-1), forming a dielectric layer 1051 on the surface of the firstpackaging layer 104 by using a chemical vapor deposition process or aphysical vapor deposition process, and patterning the dielectric layerto form openings aligning to the connecting ports of the semiconductorchip, as shown in FIG. 5a . The material of the dielectric layer may beone or a combination of epoxy resin, silica gel, PI, Polybenzoxazole(PBO), Benzocyclobutene (BCB), silica, phosphosilicate glass, andfluorine-containing glass.

Preferably, the material of the dielectric layer is PI, to furtherreduce a process difficulty and process costs.

Step 5-2), forming a metal wiring layer 1052 on a surface of thepatterned dielectric layer by using a chemical vapor deposition process,an evaporation process, a sputtering process, an electroplating process,or an electroless plating process, and patterning the metal wiringlayer, as shown in FIG. 5b . The material of the metal wiring layer maybe one or a combination of copper, aluminum, nickel, gold, silver, andtitanium.

As shown in FIG. 6 to FIG. 14, step 6): providing an antenna structure,wherein the antenna structure comprises a second packaging layer 205, afirst antenna metal layer 203, a second rewiring layer 206, and a firstmetal bump 207, wherein the first antenna metal layer 203 is disposed ona first surface of the second packaging layer 205, the second rewiringlayer 206 is disposed on a second surface of the second packaging layer205, the first antenna metal layer 203 is electrically connected to thesecond rewiring layer 206 by a first metal connecting column 204 passingthrough the second packaging layer 205, and the first metal bump 207 isformed on the second rewiring layer 206.

The step 6) of providing the antenna structure comprises the followingsteps.

As shown in FIG. 6, step 6-1): providing a second support substrate 201,and forming a stripping layer 202 on the second support substrate 201.

In an example, the second support substrate 201 may be one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate, and a ceramic substrate. In this embodiment, the glasssubstrate is selected for the second support substrate 201. The glasssubstrate is low in cost, and it is easy to form the stripping layer 202on a surface of the glass substrate, and a difficulty of a subsequentstripping process can be lowered.

In an example, the stripping layer 202 may be an adhesive tape or apolymer layer. The polymer layer is first coated on a surface of thesecond support substrate 201 by spin-coating, and then is cured by usingan ultra-violet curing process or a thermal curing process.

In this embodiment, the stripping layer 202 is thermal curing adhesive.After the thermal curing adhesive is formed on the second supportsubstrate 201 by using the spin-coating process, the thermal curingadhesive is cured by using the thermal curing process. The thermalcuring adhesive has stable performance and a smooth surface, whichfacilitate manufacturing of a subsequent rewiring layer. In addition, ina subsequent stripping process, a stripping difficulty is low.

As shown in FIG. 7 and FIG. 8, step 6-2): forming a first antenna metallayer 203 on the stripping layer 202, and forming a first metalconnecting column 204 on the first antenna metal layer 203.

As shown in FIG. 9 and FIG. 10, step 6-3): depositing over the firstantenna metal layer 203 and the first metal connecting column 204 with asecond packaging layer 205, and performing planarization treatment onthe second packaging layer 205, to expose the top surfaces of the firstmetal connecting column 204.

In an example, a method for depositing over the first antenna metallayer 203 and the first metal connecting column 204 with the secondpackaging layer 205 may be one of compression molding, transfer molding,liquid seal molding, vacuum lamination, and spin-coating. The materialof the second packaging layer 205 may be one of PI, silica gel, andepoxy resin.

As shown in FIG. 11, step 6-4): forming a second rewiring layer 206 onthe second packaging layer 205, the rewiring layer 206 includes a seconddielectric layer 2061 patterned to have openings align to the topsurfaces of the first metal connecting column, and a patterned secondmetal wiring layer 2062 on the top surface of the second rewiring layer206, and forming a first metal bump 207 connected to the patternedconductive layer on the second rewiring layer 206. The first metal bump207 may be one of a tin solder, a silver solder, and a gold-tin alloysolder.

As shown in FIG. 12, step 6-5): separating the second support substrate201 from the second packaging layer 205, to expose the first antennametal layer 203.

As shown in FIG. 13 and FIG. 14, step 6-6): performing die-cutting toform individual antenna structures.

As shown in FIG. 15, step 7): bonding the second surface of the firstrewiring layer 105 to the first metal bump 207, aligning the metal layeron the second surface to the first metal bumps 207. For example, thesecond surface of the first rewiring layer 105 may be bonded to thefirst metal bump 207 by welding.

As shown in FIG. 16, step 8): forming a second metal connecting column106 on the second surface of the first rewiring layer 105, wherein thesecond metal connecting column 106 is not lower than a top surface ofthe antenna structure.

The second metal connecting column 106 is manufactured by using a wirebonding process. The wire bonding process may be one of a thermalcompression wire bonding process, an ultrasonic wire bonding process,and a thermal compression ultrasonic wire bonding process. The materialof the second metal connecting column 106 may be one of Au, Ag, Cu, andAl. For example, the second metal connecting column 106 is Al, weldingcan be completed at a low temperature by using the ultrasonic wirebonding process, thereby greatly lowering a process temperature. Inanother example, the second metal connecting column 106 may be Au, so asto obtain electrical conductivity performance.

Preferably, the width of the first rewiring layer 105 is greater thanthe width of the antenna structure, and the second metal connectingcolumn 106 is distributed on the first rewiring layer 105 at theperiphery of the antenna structure.

As shown in FIG. 17 and FIG. 18, step 9): depositing a third packaginglayer 107 over the antenna structure, performing planarization treatmenton a surface of the third packaging layer 107, to expose a top surfaceof the second metal connecting column 106 from the third packaging layer107.

In an example, a method for packaging the antenna structure by using thethird packaging layer 107 may be one of compression molding, transfermolding, liquid seal molding, vacuum lamination, and spin-coating. Thematerial of the third packaging layer 107 may be one of PI, silica gel,and epoxy resin.

As shown in FIG. 19, step 10): forming a second antenna metal layer 108on a surface of the third packaging layer 107, wherein the secondantenna metal layer 108 is connected to the second metal connectingcolumn 106.

In this embodiment, the second antenna metal layer 108 has a window 110in an area vertically aligned with the first antenna metal layer 203, toprevent the second antenna metal layer 108 from blocking the firstantenna metal layer 203, thereby reducing mutual interference betweenmultiple layers of antennas, and improving performance of the multiplelayers of antennas.

As shown in FIG. 20, step 11): forming a via hole, (not labeled) in thefirst packaging layer 104, to expose the metal layer in the firstrewiring layer 105, and forming a second metal bump 109 in the via hole,to achieve electrical lead-out of the first rewiring layer 105.

In an example, the via for exposing the first rewiring layer 105 isformed in the first packaging layer 104 by using an etching process or alaser drilling process. The second metal bump 109 is formed in the viahole by using a bumping process. The second metal bump 109 may be one ofa tin solder, a silver solder, and a gold-tin alloy solder.

As shown in FIG. 20, an antenna package structure is further provided,comprising: an antenna circuit chip 103, a first packaging layer 104, afirst rewiring layer 105, an antenna structure, a second metalconnecting column 106, a third packaging layer 107, a second antennametal layer 108, and a second metal bump 109.

As shown in FIG. 20, the first packaging layer 104 wraps the antennachip, and comprises a first surface and a second surface opposite to thefirst surface, wherein a front surface of the antenna chip is exposedfrom the first surface. The material of the first packaging layer 104may be one of PI, silica gel, and epoxy resin.

As shown in FIG. 20, the first rewiring layer 105 is formed on the frontsurface of the antenna circuit chip 103 and the first surface of thefirst packaging layer 104. The first rewiring layer 105 comprises afirst surface connected to the first packaging layer 104, and a secondsurface opposite to the first surface.

In an example, the first rewiring layer 105 comprises a patterneddielectric layer and a patterned metal wiring layer. The material of thedielectric layer may be one or a combination of epoxy resin, silica gel,PI, PBO, BCB, silica, phosphosilicate glass, and fluorine-containingglass, and the material of the metal wiring layer may be one or acombination of copper, aluminum, nickel, gold, silver, and titanium.

As shown in FIG. 20, the antenna structure comprises a second packaginglayer 205, a first antenna metal layer 203, a second rewiring layer 206,and a first metal bump 207. The first antenna metal layer 203 isdisposed on a first surface of the second packaging layer 205, thesecond rewiring layer 206 is disposed on a second surface of the secondpackaging layer 205, the first antenna metal layer 203 is electricallyconnected to the second rewiring layer 206 by a first metal connectingcolumn 204 passing through the second packaging layer 205, the firstmetal bump 207 is formed on the second rewiring layer 206, and the firstmetal bump 207 is bonded to the first rewiring layer 105.

In an example, the second rewiring layer 206 comprises a first patterneddielectric layer, a patterned metal wiring layer, and a second patterneddielectric layer which are sequentially stacked. The material of thedielectric layer may be one or a combination of epoxy resin, silica gel,PI, PBO, BCB, silica, phosphosilicate glass, and fluorine-containingglass. The material of the metal wiring layer may be one or acombination of copper, aluminum, nickel, gold, silver, and titanium.

In an example, the material of the first metal connecting column 204 maybe one of Au, Ag, Cu, and Al.

In an example, the first metal bump 207 may be one of a tin solder, asilver solder, and a gold-tin alloy solder.

In an example, the width of the first rewiring layer 105 is greater thanthe width of the antenna structure, and the second metal connectingcolumn 106 is distributed on the second surface of the first rewiringlayer 105 at the periphery of the antenna structure.

In an example, the material of the second packaging layer 205 may be oneof PI, silica gel, and epoxy resin.

As shown in FIG. 20, the second metal connecting column 106 is formed onthe second surface of the first rewiring layer 105, and the second metalconnecting column 106 is not lower than a top surface of the antennastructure.

As shown in FIG. 20, the third packaging layer 107 wraps the antennastructure, and a top surface of the second metal connecting column 106is exposed from the third packaging layer 107.

The material of the third packaging layer 107 may be one of PI, silicagel, and epoxy resin.

As shown in FIG. 20, the second antenna metal layer 108 is formed on asurface of the third packaging layer 107, and the second antenna metallayer 108 is connected to the second metal connecting column 106.

In an example, the second antenna metal layer 108 has a window 110 in anarea vertically aligned with the first antenna metal layer 203, toprevent the second antenna metal layer 108 from blocking the firstantenna metal layer 203, thereby reducing mutual interference betweenmultiple layers of antennas, and improving performance of the multiplelayers of antennas.

The second metal bump 109 is formed in a via in the first packaginglayer 104, and is electrically connected to the first surface of thefirst rewiring layer 105. In an example, the second metal bump 109 maybe one of a tin solder, a silver solder, and a gold-tin alloy solder.

As described above, the present disclosure has the following beneficialeffects:

By using interconnecting multiple rewiring layers, multiple antennametal layers are integrated, multiple antenna package structures can bedirectly interconnected vertically, thereby greatly improving antennaefficiency and performance, and achieving high integration.

By packaging antenna structure with a fan-out packaging method, apackaging volume is effectively reduced, so that the antenna packagestructure achieves high integration and better packaging performance,and has a wide application prospect in the semiconductor packagingfield.

Therefore, the present disclosure effectively overcomes variousdisadvantages in the prior art and has high industrial utilizationvalue.

The foregoing embodiments are merely intended to exemplarily describethe principles and efficacy of the present disclosure and are notintended to limit the present disclosure. A person skilled in the artcan make modifications or changes to the foregoing embodiments withoutdeparting from the spirit and scope of the present disclosure.Therefore, any equivalent modifications or changes completed by a personof common knowledge in the art without departing from the spirit andtechnical thoughts disclosed in the present disclosure shall still fallwithin the scope of the claims of the present disclosure.

1. An antenna package structure, comprising: an antenna circuit chip; afirst packaging layer, disposed on the antenna chip, wherein the firstpackaging layer comprises a first surface and a second surface oppositeto the first surface, wherein two ports on a front surface of theantenna chip are exposed from the first surface; a first rewiring layer,formed on the first surface of the first packaging layer, wherein thefirst rewiring layer comprises a first surface connected to the twoports of the antenna chip, wherein a second surface is opposite to thefirst surface; an antenna structure, comprising a second packaginglayer, a first antenna metal layer, a second rewiring layer, and a firstmetal bump, wherein the first antenna metal layer is disposed on a firstsurface of the second packaging layer, wherein the second rewiring layeris disposed on a second surface of the second packaging layer, whereinthe first antenna metal layer is electrically connected to the secondrewiring layer by a first metal connecting column passing through thesecond packaging layer, the first metal bump is formed on the secondrewiring layer, and bonded to the first metal wiring layer of the firstrewiring layer; a second metal connecting column, formed on the secondsurface of the first rewiring layer, wherein the second metal connectingcolumn is taller than a top surface of the antenna structure; a thirdpackaging layer, disposed on the antenna structure, wherein a topsurface of the second metal connecting column is exposed from the thirdpackaging layer; a second antenna metal layer, formed on a top surfaceof the third packaging layer, wherein the second antenna metal layer ispatterned to connect to the second metal connecting column; and a secondmetal bump, formed in a via hole in the first packaging layer, andelectrically connected to the first surface of the first rewiring layer.2. The antenna package structure according to claim 1, wherein amaterial of the first packaging layer comprises one of polyimide (PI),silica gel, and epoxy resin, a material of the second packaging layercomprises one of PI, silica gel, and epoxy resin, and a material of thethird packaging layer comprises one of PI, silica gel, and epoxy resin.3. The antenna package structure according to claim 1, wherein the firstrewiring layer comprises a first patterned dielectric layer and a firstpatterned metal wiring layer.
 4. The antenna package structure accordingto claim 1, wherein the second rewiring layer comprises a stack of asecond patterned dielectric layer, a second patterned metal wiringlayer, and a third patterned dielectric layer.
 5. The antenna packagestructure according to claim 3, wherein a material of the firstpatterned dielectric layer comprises one or a combination of epoxyresin, silica gel, PI, Polybenzoxazole (PBO), Benzocyclobutene (BCB),silica, phosphosilicate glass, and fluorine-containing glass, and amaterial of the metal wiring layer comprises one or a combination ofcopper, aluminum, nickel, gold, silver, and titanium.
 6. The antennapackage structure according to claim 4, wherein a material of the secondand the third patterned dielectric layers each comprises one or acombination of epoxy resin, silica gel, PI, Polybenzoxazole (PBO),Benzocyclobutene (BCB), silica, phosphosilicate glass, andfluorine-containing glass, and a material of the metal wiring layercomprises one or a combination of copper, aluminum, nickel, gold,silver, and titanium.
 7. The antenna package structure according toclaim 1, wherein each of a material of the first metal connecting columnand a material of the second metal connecting column comprises one ofAu, Ag, Cu, and Al.
 8. The antenna package structure according to claim1, wherein the first metal bump and the second metal bump each comprisesone of a tin solder, a silver solder, and a gold-tin alloy solder. 9.The antenna package structure according to claim 1, wherein thefootprint area of the first rewiring layer is greater than the footprintarea of the antenna structure, and the second metal connecting column isdistributed on the second surface of the first rewiring layer at theperiphery of the antenna structure.
 10. The antenna package structureaccording to claim 1, wherein the second antenna metal layer has awindow in an area vertically aligned with the first antenna metal layer,to prevent the second antenna metal layer from blocking the firstantenna metal layer.